Exhibition Review | TWSC Brings a Full Series of Storage Module Solutions to the COMPUTEX Exhibition

On May 30th, the 4-day 2023 Taipei Computer Show was successfully held. As the largest information, communication, and technology exhibition in Asia, this year's exhibition features the theme of "co creating unlimited possibilities", bringing together thousands of exhibitors from multiple countries and regions around the world.

TWSC, along with its embedded and industry storage brand UDStore, made its debut at the exhibition, showcasing a full range of storage module solutions on-site, competing with global exhibitors in the industry.

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01. Expand the storage business layout and provide professional solutions for a full range of storage modules



At the exhibition, TWSC shared with on-site visitors the exploration results and development process of expanding its business layout in the storage field. Based on 15 years of technological innovation and accumulation in the consumer mobile storage market, the company has officially entered the dual track parallel operation mode of "consumer OEM+industry storage brand" with the newly merged high-end solid-state hard drive and embedded storage product lines, accurately laying out three major product lines of mobile storage, solid-state hard drive, embedded and industry storage, covering all types of NAND Flash application products, Create a full range of storage module solutions that meet user needs and industry application scenarios.

At this exhibition, TWSC not only brings PCIe Gen4x4 SSDs with speeds exceeding 7000MB/s, but also UDStore focuses on showcasing diversified industry application solutions such as enterprise grade PCIe Gen4x4 U2 SSD, UFS 3.1, wide temperature PCIe/SATA Variable-LCTM M.2 2242 SSD, showcasing specification definition capabilities that can be widely applied in mobile terminals, smart homes, automotive electronics, security monitoring, network communication equipment, industrial control equipment, and other application scenarios.

02. Strengthen supply chain layout and establish deep strategic partnerships with international brand customers

With the changing global industry trends, TWSC will plan to divide the division of labor layout between China's domestic supply chain and international supply chain based on regional markets. On the one hand, strengthen the supply chain layout. In 2022, Demingli's consolidated revenue was approximately 1.2 billion yuan, an annual increase of about 10%. Among them, the proportion of consumer products exceeded 90%, and the proportion from overseas customers reached 60%, mainly supplied to OEM or brand customers. In order to consolidate cooperation with overseas brand customers, 2023 is the first year for the company to purchase and outsource orders in Taiwan. It will expand sealed and post test orders to ensure the supply chain layout of future international brand customers; On the other hand, product development creates high-level application scenarios. TWSC has plans to develop high-end products such as PCIe Gen5, eMMC 5.1, and UFS4.0, and achieve preliminary production according to the plan. At the same time, the company's main control products start at 28 nanometers and will gradually advance to 16 or 12 nanometers, with product development towards 7 nanometers, further expanding high-end application scenarios, continuously expanding the scope and dimensions of storage comprehensive services, and establishing long-term and stable deep strategic partnerships with brand customers upstream and downstream of the industry chain.

Since its establishment, Demingli has always focused on self-developed main control chips as its core, combined with the introduction of the company's module product business model after mass production of main control chips, and innovatively pursued an endogenous growth and extensional development path. In the future, Demingli will combine technological development and market demand, focus on industry customers, understand application needs, polish products, comprehensively enhance comprehensive competitiveness, and achieve high-speed growth in the advantageous track of storage chips.

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